基于封装集成技术的高功率密度碳化硅单相逆变器
李宇雄,黄志召,方建明,陈材,康勇
SiC Single Phase Inverter with High Power Density Based on Packaging Integration Technology
LI Yuxiong,HUANG Zhizhao,FANG JianMing,CHEN Cai and KANG Yong
电源学报
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2016, (4): 103
-111
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DOI: 10.13234/j.issn.2095-2805.2016.4.103