Optimization Method for Cauer Model Considering Deforma- tion and Offset Characteristics of Dynamic Thermal Diffusion Boundary

LI Aoyang, XIN Jinlei, DU Mingxing, Member, CPSS

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PDF(17950 KB)
Journal of Power Supply ›› 2026, Vol. 24 ›› Issue (6) : 1-10. DOI: 10.13234/j.issn.2095-2805.2026.6.1
Power Semiconductor Devices and Drive Circuits

Optimization Method for Cauer Model Considering Deforma- tion and Offset Characteristics of Dynamic Thermal Diffusion Boundary

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2026, 24(6): 1-10 https://doi.org/10.13234/j.issn.2095-2805.2026.6.1

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