Estimation of IGBT Loss and Junction Temperature Based on Thermal Coupling Analysis

XIONG Liutao, LI Guoli, SUN Zehui

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Journal of Power Supply ›› 2025, Vol. 23 ›› Issue (4) : 306-315. DOI: 10.13234/j.issn.2095-2805.2025.4.306
Power Semiconductor Devices

Estimation of IGBT Loss and Junction Temperature Based on Thermal Coupling Analysis

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2025, 23(4): 306-315 https://doi.org/10.13234/j.issn.2095-2805.2025.4.306

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