Design of High Power Density SiC Power Module with Large Chips

LI Dongrun, NING Puqi, KANG Yuhui, FAN Tao, LEI Guangyin, SHI Wenhua

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 93-99. DOI: 10.13234/j.issn.2095-2805.2024.3.93
Packaging Design and Optimization

Design of High Power Density SiC Power Module with Large Chips

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 93-99 https://doi.org/10.13234/j.issn.2095-2805.2024.3.93

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