3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module

WANG Siyuan, LIANG Yuxi, SUN Peng, ZOU Mingrui, GONG Jiakun, ZENG Zheng

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 87-92. DOI: 10.13234/j.issn.2095-2805.2024.3.87
Packaging Design and Optimization

3D Packaging for Low-inductance Bidirectional Switch of SiC Power Module

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 87-92 https://doi.org/10.13234/j.issn.2095-2805.2024.3.87

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