Editorial for the Special Issue on High Reliability Power Device Packaging and Assistant Technology in EV Application

MEI Yunhui, NING Puqi, LEI Guangyin, ZENG Zheng

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 15-21. DOI: 10.13234/j.issn.2095-2805.2024.3.15
High Reliability Power Device Packaging and Assistant Technology in EV Application

Editorial for the Special Issue on High Reliability Power Device Packaging and Assistant Technology in EV Application

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 15-21 https://doi.org/10.13234/j.issn.2095-2805.2024.3.15

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