Mechanical, Thermal and Electrical Performances of IGBT Power Module with Pressureless Sintered-silver Die-attach on Nickel-metallization

WANG Meiyu, MEI Yunhui, LI Xin, HAO Baisen

PDF(1265 KB)
PDF(1265 KB)
Journal of Power Supply ›› 2023, Vol. 21 ›› Issue (1) : 195-201. DOI: 10.13234/j.issn.2095-2805.2023.1.195

Mechanical, Thermal and Electrical Performances of IGBT Power Module with Pressureless Sintered-silver Die-attach on Nickel-metallization

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2023, 21(1): 195-201 https://doi.org/10.13234/j.issn.2095-2805.2023.1.195

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1265 KB)

Accesses

Citation

Detail

Sections
Recommended

/