Progress and Considerations on Pressure-less Low-temperature Sintering of Nano-silver for Packaging Power Electronic Devices

Progress and Considerations on Pressure-less Low-temperature Sintering of Nano-silver for Packaging Power Electronic Devices

YAN Haidong, LIANG Peijie, MEI Yunhui and FENG Zhihong

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Journal of Power Supply ›› 2020, Vol. 18 ›› Issue (4) : 15-23. DOI: 10.13234/j.issn.2095-2805.2020.4.15

SiC， GaN Device, New Power Device and Its Applications

Progress and Considerations on Pressure-less Low-temperature Sintering of Nano-silver for Packaging Power Electronic Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2020, 18(4): 15-23 https://doi.org/10.13234/j.issn.2095-2805.2020.4.15

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