Pre-driver Chip Design and Packaging Integration for GaN Power Devices

Pre-driver Chip Design and Packaging Integration for GaN Power Devices

YAN Ding, SUN Weifeng, ZHU Jing and LI Dongdong

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Journal of Power Supply ›› 2019, Vol. 17 ›› Issue (3) : 64-71. DOI: 10.13234/j.issn.2095-2805.2019.3.64

SiC， GaN Device, New Power Device and Its Applications

Pre-driver Chip Design and Packaging Integration for GaN Power Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2019, 17(3): 64-71 https://doi.org/10.13234/j.issn.2095-2805.2019.3.64

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