SiC Single Phase Inverter with High Power Density Based on Packaging Integration Technology

SiC Single Phase Inverter with High Power Density Based on Packaging Integration Technology

LI Yuxiong,HUANG Zhizhao,FANG JianMing,CHEN Cai and KANG Yong

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Journal of Power Supply ›› 2016, Vol. 14 ›› Issue (4) : 103-111. DOI: 10.13234/j.issn.2095-2805.2016.4.103

SiC， GaN Device, New Power Device and Its Applications

SiC Single Phase Inverter with High Power Density Based on Packaging Integration Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2016, 14(4): 103-111 https://doi.org/10.13234/j.issn.2095-2805.2016.4.103

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