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A Review of Junction Temperature Measurement Methods of IGBT by On-state Voltage at High Current
投稿时间:2021-02-09  修订日期:2021-02-09
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DOI:
Keywords:Junction temperature monitoring  on-state voltage  IGBT
Fund Project:The National Basic Research Program of China (973 Program)
                 
AuthorInstitutionEmail
NING Puqi Institute of Electrical Engineering, Chinese Academy of Sciences npq@mail.iee.ac.cn
ZHENG Dan Institute of Electrical Engineering, Chinese Academy of Sciences zhengdan@mail.iee.ac.cn
KANG Yuhui kangyuhui@mail.iee.ac.cn
CHAI Xiaoguang chaixiaoguang@mail.iee.ac.cn
CAO Han ch404837747@mail.iee.ac.cn
WEN Xuhui wxh@mail.iee.ac.cn
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Abstract:
      In the application of electric vehicles, there is a waste of capacity of power module with state-of-the-art design method. With online monitoring of junction temperature, the reliability of converter systems can be increased. In temperature sensitive electrical parameter (TSEP) method for junction temperature monitoring, voltage drop measurement with large current conduction is very promising. To solve problems such as difficult calibration, low sampling accuracy, and verification issues, the development of thermo-electrical mod-el is an effective basis. In this paper, to meet the requirement of accurate and stable online junction temperature monitoring, researches on calibration, sampling and verification are summarized and discussed.
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