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Loss Analysis and Thermal Design of Modular Multilevel Power Am-plifier
Received:December 24, 2018  Revised:January 16, 2019
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Keywords:switching power amplifier  loss analysis  thermal design  ANSYS
Fund Project:Program for Guangdong Introducing Innovative and Entrepreneurial Teams
                 
AuthorInstitutionEmail
Han Rong National Electric Power Conversion and Control Engineering Technology Research Center Hunan University hanrong@hnu.edu.cn
Xu Qianming National Electric Power Conversion and Control Engineering Technology Research Center Hunan University hnuxqm@foxmail.com
CHEN Yandong National Electric Power Conversion and Control Engineering Technology Research Center Hunan Univers yandong_chen@hnu.edu.cn
何志兴 National Electric Power Conversion and Control Engineering Technology Research Center Hunan Univers hezhixingmail@163.com
欧阳红林 National Electric Power Conversion and Control Engineering Technology Research Center Hunan Univers Oyhl1405.ouyang@vip.sina.com
罗安 National Electric Power Conversion and Control Engineering Technology Research Center Hunan Univers an_luo@126.com
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Abstract:
      Switching power amplifiers have a wide range of applications in civil and military, such as electrical vibration test rigs and elec-tro-acoustic emission systems and many other important areas. A modular multi-level structure of high-power switching power amplifi-er and its working principle are studied in this paper. In addition, the thermal loss of the modular multi-level switching power amplifier is analyzed and the relationship between loss and power factor is discussed. According to the result of theoretical analysis, the cooling system of equipment is designed. Then, the thermal system is simulated by software PLECS and finite element analysis software ANSYS. Finally, a 30kW modular multilevel switching power amplifier prototype is developed to verify the theoretical analysis and simulation results.
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