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HAN Rong,XU Qianming,CHEN Yandong,HE Zhixing,OUYANG Honglin,LUO An.Loss Analysis and Thermal Design of Modular Multi-level Power Amplifier[J].JOURNAL OF POWER SUPPLY,2020,18(3):95-105
Loss Analysis and Thermal Design of Modular Multi-level Power Amplifier
Received:December 24, 2018  Revised:August 24, 2019
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DOI:10.13234/j.issn.2095-2805.2020.3.95
Keywords:switching power amplifier  loss analysis  thermal design  ANSYS
Fund Project:Program for Guangdong Introducing Innovative and Entrepreneurial Teams
                 
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HAN Rong Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
XU Qianming Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
CHEN Yandong Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
HE Zhixing Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
OUYANG Honglin Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
LUO An Guangdong Zhicheng Champion Group Co., Ltd, Dongguan , China;National Electric Power Conversion and Control Engineering Technology Research Center, Hunan University, Changsha , China
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Abstract:
      Switching power amplifiers have a wide range of applications in civil and military fields, such as electrical vibration test rigs and electro-acoustic emission systems. In this paper, a high-power switching power amplifier with a modular multi-level structure is studied, together with an introduction of its working principle. In addition, the thermal loss of this amplifier is analyzed in detail, and the relationship between its loss, load power, and power factor is discussed. According to the result of theoretical analysis, the thermal system of the novel amplifier is designed, which is further verified through simulations using software PLECS and finite element analysis software ANSYS. Finally, a 30 kW modular multi-level switching power amplifier prototype was developed to verify the theoretical analysis and simulation results.
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