• 首页|关于本刊|编委阵容|投稿指南|审稿指南|订阅指南|征稿启事|诚邀专家|学术道德|English
  • E-mail:
  • 密 码: 
  •    
  • 用户名:
  • 密 码: 
  •    
最新录用 更多>>
李阳,郑庆红.大功率IGBT散热设计的模拟及实验研究[J].电源学报,2018,16(1):107-111
大功率IGBT散热设计的模拟及实验研究
Simulation and Experimental Investigation on the Thermal Design of High-power IGBT
投稿时间:2016-01-03  修订日期:2017-12-20
DOI:10.13234/j.issn.2095-2805.2018.1.107
中文关键词:  功率器件  热设计  IGBT  散热器  热阻
英文关键词:power device  thermal design  IGBT  heat sink  thermal resistance
基金项目:
作者单位E-mail
李阳 西安建筑科技大学环境与市政工程学院, 西安 710055 121831808@qq.com 
郑庆红 西安建筑科技大学环境与市政工程学院, 西安 710055  
摘要点击次数: 155
全文下载次数: 161
中文摘要:
      随着当代电子技术发展迅速,大功率电子产品的热流密度不断增长,体积在不断缩小。器件中心温度控制对其工作的可靠性具有重要影响,因此电子产品对冷却技术的要求更加严苛。针对某大功率器件IGBT模块的这些特点,利用Icepak建立原有产品的计算机模型,并用实验验证建立的可靠性。在此基础上,对铝制散热器结构和运行参数进行模拟优化分析。分析散热器肋片厚度、肋片高度及风量对于散热器热阻的影响,从而得出散热器的最佳设计方案。
英文摘要:
      With the rapid development of modern electronic technology nowadays, the heat flux density of high-power electronic products is growing while their volumes are diminishing. The control of temperature at the center of devices affects the reliability of their operations, therefore, more requirements are required for the cooling technology. In this paper, considering the above characteristics of an IGBT module in a high-power device, a computer model for the original product was established using Icepak, and its reliability was experimentally verified. On this basis, the aluminum heat-sink's structure and operation parameters were simulated and optimized. By analyzing the effects on the heat-sink's thermal resistance resulting from the fins' thickness and height, as well as the air volume, an optimization scheme was obtained.
查看全文  查看/发表评论  下载PDF阅读器
关闭